Description:
The Automatic MOSFET Bending Machine is designed for precise and uniform bending of TO-220 package component leads like MOSFETs and IGBTs. It ensures quick, consistent bends for easy PCB mounting, making it ideal for electronics assembly.
Specifications:
| Model | MBM 10 |
| Operation Mode | Pneumatic |
| Air Pressure | 40 PSI |
| Compatible Components | TO-220 Package (MOSFETs, IGBTs, Voltage Regulators, etc.) |
| Lead Bending Capacity | Typically up to 1.5 mm Lead Thickness |
| Bending Style | Uniform Right-Angle Bends for PCB Insertion |
| Weight | 8 Kg |
Features:
- Provides uniform and consistent bends, ensuring correct component alignment for PCB mounting.
- Durable metal body ensures long life and reliable operation under regular use.
- Automatic press operation-electricity required—ideal for both workshop and field use.
- Speeds up lead-forming process compared to manual plier-based methods.
Suitable for various TO-220 components like MOSFETs, IGBTs, and Voltage Regulators.
